BS IEC 60748-11:2000 pdf download.Semiconductor devices - Sectional specification for semicond uctor integrated circuits excluding hybrid circuits
1 Scope
This sectional specification applies to encapsulated semiconductor integrated circuits, including multi-chip integrated circuits, but excluding hybrid circuits.
2 General
This specification shall be read together with the generic specification to which it refers and it gives details on the Quality Assessment Procedures, the inspection requirements, screening sequences, sampling requirements, and test and measurement procedures required for the assessment of semiconductor integrated circuits, including digital, analogue and interface circuits.
Instead of the Qualification Approval Procedure, it is allowed to apply the Capability Approval Procedure (see IEC Publication QC 001002, Rules of Procedure, Subclause 11.7; but at present, Capability Approval Procedures for integrated circuits are under consideration) for all devices manufactured in a defined process.
Additional application of the Quality Conformance Inspection rules (see IEC Publication 747-10,Sub-clause 3.6, and this specification, Clauses 5 to 9) is possible for any type or group of types, produced in that process, if required and technically feasible.
All the requirements of this specification remain valid, unless modified by the requirements set out in the new clause“Capability Approval Procedure" (under consideration).
2.4.2 Production lot
A production lot consists of devices of the same type, manufactured in the same production line and passing through the same nominated process, normally within one week.
2.4.3 Changes in manufacturing operations
1) Definition of major changes
Any change in manufacturing process or technology which could affect the quality or performance of a product supplied to an approved specification, or which could require a product to be transferred from one structural similarity group of circuits to another (new or existing) group (see Clause 6 below) represents a change considered as major. It is the responsibility of the Chief Inspector to decide whether the change is major or not.
Some examples of major changes are given in 3) below.
2) Procedure in the event of a major change
Any major change shall only be implemented with notification and demonstration by test evidence of maintenance of quality to the NSI.
3) Examples of major changes
a) Die attach
一from eutectic solder to epoxy attachment.
Not considered as a major change: equipment change without changing the technology or the use of preform instead of gold plated alloy surfaces.
b) Crystal passivation
一from silicon-nitride to silicon-oxide;
一sequence of the passivation layers.
Not considered as a major change: changing of the method of deposition of the passivation layers.
c) Package material
一from ceramic to plastic;
一from plastic A to plastic B.BS IEC 60748-11 pdf download.