IEC 60317-2:2000 pdf download.Specifications for particular types of winding wires
1 Scope
This International Standard specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The supe rimposed coating is a bonding layer based on a thermoplastic res in.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certa in pe rformance or applic ation characte ris tics.
Class 130 is a thermal class that requires a minimum te mperature index of 130 and a heat shock temperature ofat least 155 °C.
The te mperature in degrees Ce ls ius corres ponding to the te mperature index is not necess arily that at which it is recommended that the wire be operated and this will depend on many factors, including the type of equipment involved.
The range of nominal conductor diameters covered by this standard is:
一Grade lB: 0,020 mm up to and including 2,000 mm;
一Grade 2B: 0,020 mm up to and including 2 ,000 mm.
The nominal conductor diameters are specified in clause 4 of IEC 6031 7-0-1.
2.Normative references
The following standard contains provisions which, through reference in this text, cons titute provisions of this International S tandard. At the time of publication, the edition indicated was valid. All standards are subject to revision, and parties to agreements based on this Inte rnational Standard are encouraged to investigate the possibility of applying the most recent edition of the standard indicated be low. Members of IEC and ISO maintain registers of currently va lid inte rnational standards.
IEC 60317-0-1:1990，Specifications for particular types of winding wires 一Part 0: General requirements一Section 1: Enamelled round copper wire.
18.1.1.1 At room temperature
The specimens shall be prepared according to the test method, and the te mperature of the oven for bonding shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested te mpe rature for polyamide bonding enamel is (200±2) °C and the sugges ted te mpe ra ture for polyvinyl butyral bonding enamelis (170±2) °C.
Results: when testing the specimens according to the test method, under the action of load specified in table 2, no turns other than possibly the first and the last shallbe separated.
18.1.1.2 At elevated temperature
The specimens shallbe prepared and shall be conditioned as described in the test method.
The e levated te mperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested te mpe rature for polya mide bonding enamel is (155±2)。C and the sugges ted temperature for polyvinyl butyral bonding enamelis (90±2) °C.IEC 60317-2 pdf download.